Dynamic switch driver for low-distortion programmable-gain amplifier

ABSTRACT

A switching circuit for switching a time-varying input signal, the switching circuit comprising: at least one switch including a N-channel MOSFET and a P-channel MOSFET, each having a gate configured to receive a drive signal to change the ON/OFF state of the switch; and a drive circuit configured and arranged so as to selectively apply a pair of drive signals to change the ON/OFF state of the switch, the drive circuit being configured and arranged to generate the drive signals as a function of (a) a pair DC signal components sufficient to change the ON/OFF state of the switch and (b) a pair of time-varying signal components as at least a partial replica of the signal present on the source terminal of each MOSFET so that when applied with the DC signals to the gates of the n-channel MOSFET and p-channel MOSFET respectively, the drive signals will be at the appropriate level to maintain the ON/OFF state of the switch and keep the gate-source voltages of each MOSFET within the gate-source breakdown limit of the MOSFETs.

RELATED APPLICATIONS

The present application is related to and claims priority from U.S.Provisional Patent Application Ser. No. 61/234,039 filed Aug. 14, 2009in name of Gary K. Hebert and entitled Dynamic Switch Driver forLow-Distortion Programmable-Gain Amplifier, and U.S. ProvisionalApplication Ser. No. 61/234,031 filed Aug. 14, 2009 in the name of GaryK. Hebert and entitled Area Efficient Programmable-Gain Amplifier, bothapplications being assigned to the present assignee. The presentapplication is also related to and incorporates by reference co-pendingapplication U.S. Ser. No. 12/857,099, filed contemporaneously with thepresent application in the name of Gary K. Hebert and entitled AreaEfficient Programmable-Gain Amplifier and hereinafter being referred toas the “Copending Application”), the latter application also claimingpriority from the Provisional Applications and being assigned with thisapplication to a common assignee.

FIELD

The disclosure describes generally a programmable-gain amplifier, andmore specifically a low-noise, dynamic switch driver useful inapplications including, but not limited to low-distortionprogrammable-gain amplifiers with discrete controllable gain settingsimplemented with high-voltage, complementary, metal-oxide semiconductor(CMOS) switches.

BACKGROUND

Low-distortion programmable-gain amplifiers have many applications. Forexample they are useful in processing analog audio signals where it isimportant to preserve the integrity of the signals. One prior artimplementation of a low-distortion programmable-gain amplifier is shownin FIG. 1. An input signal, which may be AC or DC, is applied to theinput V_(IN). The output signal appears at the output V_(OUT). In thisembodiment the high-gain operational amplifier A₁ is configured as anon-inverting amplifier. This configuration is preferred for low-noiseapplications over the inverting configuration since the feedback networkcan be made low impedance to minimize its thermal noise contributionwithout compromising the amplifier input impedance, which may be setindependently via resistor R_(IN). The feedback network aroundoperational amplifier A₁ is tapped at any one of a plurality of pointsby selectively controlling the corresponding electronic switch elementsS₁ through S_(N). These switch elements are typically each constructedof complementary metal-oxide semiconductor (CMOS) devices. Controlsignals (C₁ through C_(N)) select the desired gain by turning on theassociated switch. Such an approach has the benefit that the variationsin ON-resistance of electronic switches S₁ through S_(N) due to changesin input voltage do not affect the linearity of the output signal sinceno signal current flows through these switches. This minimizesdistortion, so long as one and only one of electronic switches S₁through S_(N) is turned on at any one moment in time.

However, the ON-resistance of each of these switches does contributethermal noise to the total input noise of the amplifier. One way todecrease the ON-resistance of CMOS electronic switches (and thus toreduce the amplifier's input noise) is to increase the physical width ofthe CMOS devices which make up the switches. In an integrated circuit,however, an increase in the width of a switch results in an increaseddie area. Since the approach illustrated in FIG. 1 requires one switchfor each desired gain setting, the necessary area taken by the switchesin an integrated circuit can be a significant issue.

Another aspect of CMOS electronic switches is that modern CMOS processesoften do not allow large voltages to be applied between the gate andchannel (source and drain) of the switches, even for so-called“high-voltage” CMOS processes. This can limit the analog voltages whichmay be switched by CMOS electronic switches, thus restricting themaximum analog voltages, Vin, which can be applied at input of theswitch.

Accordingly, it is desirable to provide a dynamic switch driver for alow-distortion programmable-gain amplifier that overcomes or at leastsubstantially reduces the foregoing disadvantages.

SUMMARY

In accordance with one aspect of the invention, a switching circuit forswitching a time varying input signal is provided. The switching circuitcomprises: at least one switch including a N-channel MOSFET and aP-channel MOSFET, each having a gate configured to receive a drivesignal to change the ON/OFF state of the switch; and a drive circuitconfigured and arranged so as to selectively apply a pair of drivesignals to change the ON/OFF state of the switch, the drive circuitbeing configured and arranged to generate the drive signals as afunction of (a) a pair DC signal components sufficient to change theON/OFF state of the switch and (b) a pair of varying signal componentsas at least a partial replica of the signal present on the sourceterminal of each MOSFET so that when applied with the DC signals to thegates of the n-channel MOSFET and p-channel MOSFET respectively, thedrive signals will be at the appropriate level to maintain the ON/OFFstate of the switch and keep the gate-source voltages of each MOSFETwithin the gate-source breakdown limit of the MOSFETs.

In accordance with another aspect of the invention, a method ofswitching a time varying input signal uses at least one switch includinga N-channel MOSFET and a P-channel MOSFET, each having a gate configuredto receive a drive signal to change the ON/OFF state of the switch. Themethod comprises: selectively applying a pair of drive signals to changethe ON/OFF state of the switch by generating the drive signals as afunction of (a) a pair DC signal components sufficient to change theON/OFF state of the switch and (b) a pair of varying signal componentsas at least a partial replica of the signal present on the sourceterminal of each MOSFET so that when applied with the DC signals to thegates of the n-channel MOSFET and p-channel MOSFET respectively, thedrive signals will be at the appropriate level to maintain the ON/OFFstate of the switch and keep the gate-source voltages of each MOSFETwithin the gate-source breakdown limit of the MOSFETs.

Although reference is made herein to switching “AC signals”, it shouldbe understood that the term “AC signals” is not intended to be limitedto signals that return to ground (with no DC component), but alsoinclude any time varying signals whose amplitude varies over time, andcan include DC signals of either polarity, and signals whose amplitudecan include DC components so as to include both polarities over time.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference is made to the attached drawings, wherein elements having thesame reference character designations represent like elementsthroughout, and wherein:

FIG. 1 is a partial schematic, partial block diagram of a prior artimplementation of a low-distortion, programmable-gain amplifier;

FIG. 2 is a partial schematic, partial block diagram of one embodimentof a more area-efficient, single-ended amplifier constructed inaccordance with the teachings described in the Copending Application andfurther described herein;

FIG. 3 is a partial schematic, partial block diagram of a CMOStransmission gate that can be used as each of the switches shown in theFIG. 2 embodiment;

FIG. 4 is an amplitude-time graphical illustration of exemplaryOFF-voltage waveforms for switch gates s_(f1)˜s_(fn) shown in FIG. 2;

FIG. 5 is an amplitude-time graphical illustration of exemplaryON-voltage waveforms for switch gates S_(F1) through S_(Fn) shown inFIG. 2;

FIG. 6 is an amplitude-time graphical illustration of exemplaryON-voltage waveforms for switch gates S₁ through S_(N) shown in FIG. 2;

FIG. 7 is an amplitude-time graphical illustration of exemplaryOFF-voltage waveforms for switch gates S₁ through S_(N) shown in FIG. 2;

FIG. 8 is a block diagram of one embodiment of a switch driver that canbe used to operate the amplifier of the type described in the CopendingApplication such as the amplifier shown in FIG. 2;

FIG. 9 is a schematic diagram of one embodiment of an N-channel gatedrive circuit that can be implemented as a part of the switch drivershown in FIG. 8 for operating the N-channel MOSFET of the CMOStransmission gate shown in FIG. 3; and

FIG. 10 is a schematic diagram of one embodiment of an P-channel gatedrive circuit that can be implemented as a part of the switch drivershown in FIG. 8 for operating the P-channel MOSFET of the CMOStransmission gate shown in FIG. 3.

DETAILED DESCRIPTION OF THE DRAWINGS

In the drawings, FIG. 2 is a schematic representation of an embodimentof a more area-efficient programmable-gain amplifier, described in theCopending Application. High-gain operational amplifier A₁ is configuredas a non-inverting amplifier, with the input voltage V_(IN) beingapplied to the non-inverting input of the amplifier. Resistor R_(IN)substantially sets the amplifier input impedance. Resistors R₁ throughR_(N+1) are connected in series between the output of the amplifier A₁and system ground or a reference node, and comprise a tapped resistorstring that provides feedback via a series of discrete voltage dividersselected via electronic switches S₁ though S_(N). Control signals C_(C1)through C_(CN) are used to select one of a series of individualclosed-loop gain settings by turning on a corresponding one of theelectronic switches S₁ through S_(N) so as to connect a single pointalong the tapped resistor string to the inverting input of amplifier A1.In addition, one or more of the resistors R_(F1) through R_(FM) modifythe closed-loop gain when they are connected in parallel with resistorR₁ via electronic switches S_(F1) through S_(FM). Control signals C_(F1)through C_(FM) determine the state of switches S_(F1) through S_(FM)respectively, selectively turning one or more of them on so as toconnect those resistors R_(F1) through R_(FM) (for which thecorresponding switches S_(F) have been turned on) in parallel withresistor R₁.

Electronic switches S₁ through S_(N) and S_(F1) and S_(FM) each includea CMOS transmission gate. Such transmission gates comprise an N-channelMOS transistor and a P-channel MOS transistor in parallel, asillustrated in FIG. 3. One source-drain terminal of P-channel MOSFETM_(A) is connected to one source-drain terminal of N-channel MOSFETM_(B). The remaining source-drain terminals of M_(A) and M_(B) are alsoconnected together. In operation, the body connection of P-channelMOSFET M_(A) is connected to a voltage Vdd more positive than themaximum expected voltage on either of its source-drain terminals. Thebody connection of N-channel MOSFET M_(B) is connected to a voltage Vssmore negative than the maximum expected voltage on either of itssource-drain terminals. These are often the positive and negative powersupply voltages used with the integrated circuit containing one or moreof these switches.

Control of the state of each transmission gate is accomplished via thegate terminals of the two MOSFETS, M_(A) and M_(B). More specifically,when the gate of P-channel MOSFET M_(A) is made sufficiently negativewith respect to its source-drain terminals, and the gate of N-channelMOSFET M_(B) is made sufficiently positive with respect to itssource-drain terminals, both devices are considered to be operating inthe triode region, and are characterized by a relatively low resistancebetween the two source-drain terminals SD₁ and SD₂. This resistancebetween the source-drain terminals of each device is often referred toas the ON-resistance (thereby defining the ON-state of the device), andcan be approximately characterized by the following equation:

$\begin{matrix}{r_{dson} = {\frac{1}{\mu\;{C_{OX}\left( \frac{W}{L} \right)}\left( {V_{GS} - V_{t}} \right)} = \frac{1}{\mu\;{C_{OX}\left( \frac{W}{L} \right)}\left( V_{eff} \right)}}} & (1)\end{matrix}$

wherein μ is the mobility of the carriers in the channel,

C_(OX) is the gate capacitance per unit area,

W and L are the channel width and length, respectively,

V_(GS) is the gate-source voltage, and

V_(t) is the threshold voltage (the threshold voltage is thatgate-source voltage above which a channel is present); and

V_(eff) is the effective gate-source voltage, V_(GS)-V_(t).

From equation (1), it is clear that reducing ON-resistance requires somecombination of increased carrier mobility, increased gate capacitanceper unit area, increased gate width, reduced gate length, and/orincreased effective gate-source voltage. Carrier mobility may beadjusted over a limited range (approximately 20:1 for electrons and 10:1for holes at room temperature) by adjusting the doping concentration inthe source and drain regions. However, increasing doping concentrationsin the source and drain reduces breakdown voltage, which reduces thesignal voltages that can be applied when the switch is in the OFF-state.Increasing gate capacitance per unit area requires thinner gate oxide.Reducing the gate-oxide thickness reduces the gate-source breakdownvoltage, and, thus can compromise the transmission gate's ability tohandle large signal voltages. As many applications for MOS switchesinvolve DC, rather than AC, signals, high-voltage CMOS processes oftentrade the lower gate-source breakdown voltage that results from thinnergate oxide for the lower ON-resistance that this brings. The resultingdevices exhibit lower gate-source breakdown voltages than drain-sourcebreakdown voltages. For applications where the source stays at a fixedvoltage, and the switched load is in series with the drain, thegate-source voltage can easily be limited to the V_(eff) required toreach the minimum ON-resistance for the device where it is no longergoverned by equation (1), but is limited by other ohmic resistances. Theimprovements described herein allow the use of such devices forswitching varying voltages that exceed the gate-source breakdownvoltage.

Referring again to FIG. 2, gain-control switches S_(F1) through S_(FM)(hereafter referred to as the “S_(Fi)” switches) will be exposed tosignal voltages on the terminals labeled 2 and 3 corresponding to thesource-drain terminals of the CMOS switch of the type shown in FIG. 3.When any of these switches is in the OFF-state, one side of the switch,labeled as terminal 3 in FIG. 2, will be at the same voltage as theoutput voltage, V_(OUT), of amplifier A₁. The other side of the switch,labeled as terminal 2 in FIG. 2, will be at a voltage equal to afraction of V_(OUT) determined by the settings of the other S_(Fi)switches and by the voltage division provided by the string of resistorsR₁ through R_(N+1). This voltage is labeled V₁ in FIG. 2.

By definition, the source terminal for the N-channel MOSFET in the CMOSswitch in FIG. 3 is the terminal at the more negative potential, whilethe drain terminal of the N-channel MOSFET is the terminal at the morepositive potential. In order to keep the N-channel MOSFET in theOFF-state, the gate voltage must be less than or equal to the sourcevoltage. Similarly, the source terminal for the P-channel MOSFET in FIG.3 is defined as the more positive of the two source-drain terminals,while the drain terminal of the P-channel MOSFET is the more negative ofthe two. To keep the P-channel MOSFET in the OFF-state, the gateterminal voltage on the P-channel MOSFET must be greater than or equalto the source voltage.

If the switch is fabricated in a process in which the gate-sourcebreakdown voltage is equal to or greater than the source-drain voltage,common practice to turn the CMOS switch off is to connect the N-channelMOSFET gate to the most negative power supply voltage applied to theintegrated circuit, and the P-channel MOSFET gate to the most positivepower supply voltage applied to the integrated circuit in order toensure that both MOSFETs stay OFF for any possible signal voltage withinrange of the power supplies.

However, for high-voltage CMOS processes as described above, in whichthe gate-source breakdown voltage is substantially less than thesource-drain breakdown voltage, this practice could lead to breakdown ofthe gate oxide and damage to the device. In an example of oneembodiment, the CMOS switch is fabricated in a high-voltage CMOS processin which the source-drain breakdown voltage of each of the N-channel andP-channel devices exceeds 40V, but the gate-source breakdown voltage foreach of the devices is 20V. The typical power supply voltages utilizedin the example are +15V and −15V. The signal voltages at V_(IN) andV_(OUT) can be anywhere within the range defined by these voltages. If,for example, the gate of the N-channel MOSFET were connected to −15V toturn it OFF, a voltage greater than +5V at V₁ would cause thegate-source voltage to exceed the N-channel MOSFET' s maximumgate-source voltage rating. Similarly, a voltage at V₁ less the −5Vwould cause the gate-source voltage of the P-channel MOSFET to exceedits maximum rating.

In order to keep both MOSFETS in the OFF-state, but at the same time notviolate the maximum gate source voltage, a gate-drive circuit can beused to maintain the N-channel MOSFET gate voltage at or slightly belowthe source voltage at all times. The source voltage for the N-channelMOSFET in the SF_(i) switches in FIG. 2 will be the lesser of V₁ andV_(OUT). The source voltage for the P-channel MOSFET in the SF_(i)switches in FIG. 2 will be the greater of V₁ and V_(OUT). Accordingly,the gate voltages of the N-channel MOSFETs are driven in the OFF-statewith a voltage slightly below the lesser of V₁ and V_(OUT), and thegates of the P-channel MOSFETs with a voltage slightly above the greaterof V₁ and V_(OUT), as illustrated in FIG. 4. In FIG. 4, V_(OFFN) is thusa gate voltage capable of maintaining the N-channel MOSFET in theOFF-state, and V_(OFFP) is the preferred gate voltage capable ofmaintaining the P-channel MOSFET in the OFF-state.

Referring again to FIG. 2, whenever any of the S_(Fi) switches areturned on, the source and drain voltages of both MOSFETs for that switchwill be at approximately V₁. In order to maintain both MOSFETs of thatswitch in the ON-state, the gate-source voltage of the NMOS device mustbe kept sufficiently positive to provide the desired ON-resistance, andthe gate-source of the PMOS device must be kept sufficiently negativefor the same reason. In prior art designs that utilize low power supplyvoltages, this is typically done by connecting the NMOS gate to avoltage substantially equal to the positive power supply voltage, andthe PMOS gate to a voltage substantially equal to the negative supplyvoltage.

However, in order to accommodate signal voltages that exceed thegate-source breakdown voltage, a simple connection to a voltagesubstantially equal to the positive or negative supply voltages is notpossible. In order to prevent breakdown of the gate oxide, the NMOSdevice gate-source voltage is preferably kept equal to V₁ plus asufficient positive offset to ensure low ON-resistance. Likewise, thePMOS device gate-source voltage is preferably kept equal to V₁ plus asufficient negative offset to ensure low ON-resistance. This isillustrated in FIG. 5, which shows an example of a signal voltage V₁,and a gate voltage V_(ONN) applied to maintain the NMOS device in theON-state, and a gate voltage V_(ONP) applied to maintain the PMOS devicein the ON-state. Since the gate-source voltage of each device is keptsubstantially constant with changes in signal voltage, any distortioncontribution due to variation in switch ON-resistance with signalvoltage is minimized. In an example of one embodiment, the offsetvoltage between V₁ and V_(ONN) is approximately +9V, and the offsetvoltage between V₁ and V_(ONP) is approximately −9V.

Gain-control switches S₁ through S_(N) in FIG. 2 require similarprotection from damaging gate-source voltages. As described in theCopending Application, switches S₁ through S_(N) are utilized by turningonly one of these switches on at a time, which minimizes any distortioncontribution from the switch due to variations in ON-resistance withsignal voltage. Thus, the switch that is turned on will have inputsignal voltage V_(IN) on the source and drain of both MOSFETs, as longas amplifier A₁ is operating in its linear region. The rest of thegain-control switches S₁ through S_(N) will see this same voltage on theterminals 3 in FIG. 2. The terminals of these switches labeled 2 in FIG.2 will be at a voltage equal to a fraction of V_(OUT) determined by thesettings of the S_(Fi) switches and by the voltage division provided bythe string of resistors R₁ through R_(N+1). These voltages are labeledas V₁ through V_(N) in FIG. 2.

As described above for the switches S_(F1) through S_(FM), in oneexample the magnitude of the gate-source breakdown voltage of the NMOSand PMOS devices that make up switches S₁ through S_(N) is 20V and thetypical power supply voltages for opamp A₁ are +15 V and −15 V. If thegate of each of the NMOS devices were tied to +15 V and the gate of eachof the PMOS devices were tied to −15 V in order to keep the desiredswitches S₁ through S_(N) in the ON-state, input signal voltages atterminal V_(IN) in excess of +5 V or −5V would exceed the maximumgate-source voltage on devices in switches. Similarly as with switchesS_(F1) through S_(FM), in order to protect against exceeding the maximumgate-source voltage, the NMOS gate-source voltage for switches S₁through S_(N) is preferably kept equal to the voltage at the invertinginput of operational amplifier A₁ plus a sufficient positive offset toensure low ON-resistance. Similarly, the PMOS gate-source voltage forswitches S₁ through S_(N) is preferably kept equal to the voltage at theinverting input of operational amplifier A₁ plus a sufficient negativeoffset to ensure low ON-resistance. This is illustrated in FIG. 6, whichshows an example of an operational amplifier A₁ inverting input voltage,V_(IN−), and a preferred gate voltage V_(ONN) to maintain the NMOSdevice in the ON-state, and a preferred gate voltage V_(ONP) to maintainthe PMOS device in the ON-state. In one example of the illustratedembodiment, the offset voltage between V_(IN−) and V_(ONN) isapproximately +9V, and the offset voltage between V_(IN−) and V_(ONP) isapproximately −9V.

The MOSFETs in those switches S₁ through S_(N) that are turned OFF mayalso potentially be exposed to excessive gate-source voltages if thegates were driven to the power supply voltages to maintain the MOSFETsin the OFF-state. In particular, even at the highest gain settings(typically achieved when switch S_(N) in FIG. 2 is turned on), switchesS₂ through S_(N) can be exposed to large voltage swings on both signalterminals. One way in which this can occur is if operational amplifierA₁ is of the type known in the art that includes protection fromexcessive differential input voltages, such as those includingback-to-back diodes across their input terminals. In such case, theinverting and non-inverting inputs of operational amplifier A₁ willnever be more than 1 volt apart. Thus, large input voltages at terminalV_(IN) will be largely reflected to the inverting input terminal. Athigh gain settings, such large input voltages will cause the output ofoperational amplifier A₁ to clip at the maximum possible output voltage,typically within a few volts or less of the supply voltages, while thehigh input signal level itself causes the large input voltage to appearat terminals 3 of switches S₁ through S_(N). Thus, each of thoseswitches S₁ through S_(N−1) may be exposed to signal voltages thatapproach either of the supply voltages on both signal terminals (2 and3).

As described above for gain-control switches S_(F1) through S_(FM), thepreferred gate voltage for maintaining the N-channel MOSFETs in theOFF-state while not violating the maximum gate-source voltage is avoltage equal to or slightly less than the source voltage. For theN-channel MOSFETs in gain-control switches S₁ through S_(N), the sourcevoltage will be the lesser of the voltage at the inverting input ofoperational amplifier A₁ (V_(IN−)) and the voltage (V_(N) for switchS_(N)) at the other side of the switch. Similarly, the preferred gatevoltage for the P-channel MOSFETs in the OFF-state will be equal to orslightly greater than the source voltage, which will be the greater ofV_(IN−) or V_(N) for switch S_(N). These waveforms are illustrated inFIG. 7.

FIG. 8 is a partial schematic and partial block diagram illustrating oneembodiment of a circuit for generating gate-control voltages for thetransmission-gate of the N-channel and P-channel MOSFETs. Referring toFIG. 8, a CMOS transmission gate includes MOSFETs M_(A) and M_(B).Signal voltages V_(SD1) and V_(SD2), appearing at the inputs SD1 and SD2and applied to the source-drain terminals SD₁ and SD₂, are also bufferedby unity-gain amplifiers, Buffer₁ and Buffer₂, respectively, to preventany loading of the gain-control network (an embodiment of which is shownin FIG. 2 as including resistors R1 through RN+1 and R1 through RFM).The output of amplifier Buffer₁ is connected to the negative terminal ofoffset voltage source V_(OS1), the positive terminal of offset voltagesource V_(OS2,) the first input of “less-than-or-equal-to” Block₁ andthe first input of “greater-than-or-equal-to” Block₂, all of whichcomprise the switch-driver circuit SDC. Thus, the voltage V_(ONN) at thepositive terminal of voltage source V_(OS1) will be equal to the voltageat terminal SD₁ plus a positive offset determined by the voltageprovided by V_(OS1). If the offset voltage V_(OS1) is chosenappropriately as described above, then voltage V_(ONN) will be asuitable gate voltage to maintain N-channel MOSFET M_(B) in the ON-statein accordance with the present disclosure. Similarly, the voltageV_(ONP) at the negative terminal of voltage source V_(OS2) will be equalto the voltage at terminal SD₁ plus a negative offset determined by thevoltage provided by V_(OS2). If the offset voltage V_(OS2) is chosenappropriately as described above, then voltage V_(ONP) will be asuitable gate voltage to maintain P-channel MOSFET M_(A) in theON-state.

The output of amplifier Buffer₂ is connected to the second input of“less-than-or equal-to” Block₁ and the second input of“greater-than-or-equal-to” Block₂. The output of Block₁, V_(OFFN), willbe a voltage equal to the more negative of the two voltages at itsinputs, or the voltage at both inputs if the input voltages are equal.The output of Block₂, V_(OFFP), will be a voltage equal to the morepositive of the two voltages at its inputs, or the voltage at bothinputs if the input voltages are equal. Thus, the voltage V_(OFFN) atthe output of Block₁ will be equal to the more negative of the voltagesat switch terminals SD₁ and SD₂, and will be a suitable gate voltage tomaintain N-channel MOSFET M_(B) in the OFF-state. Similarly, the voltageV_(OFFP) at the output of Block₂ will be the more positive of thevoltages at switch terminals SD₁ and SD₂, and will be a suitable gatevoltage to maintain P-channel MOSFET M_(A) in the ON-state.

Switches SW₁ and SW₂ are representative of electronic switches that arecontrolled by control signal V_(CONTROL). Control signal V_(CONTROL)preferably has two states; an “ON” state for turning MOSFETs M_(A) andM_(B) on, and an “OFF” state for turning MOSFETs M_(A) and M_(B) OFF.When control signal V_(CONTROL) is in the “ON” state, terminals 2 and 3of switch SW₁ are connected, and terminals 2 and 3 of switch SW₂ areconnected, applying the appropriate gate voltages V_(ONN) and V_(ONP) toMOSFETs M_(B) and M_(A), respectively, to maintain both MOSFETs in theON-state. When control signal V_(CONTROL) is in the “OFF” state,terminals 1 and 2 of switch SW₁ are connected, and terminals 1 and 2 ofswitch SW₂ are connected, applying the appropriate gate voltagesV_(OFFN) and V_(OFFP) to MOSFETs M_(B) and M_(A), respectively tomaintain both in the OFF-state.

It should be noted that the negative terminal of offset voltage sourceV_(OS1) and/or the positive terminal of offset voltage source V_(OS2)could be alternatively connected to the output of amplifier Buffer₂instead of the output of amplifier Buffer₁ with no loss offunctionality, since, when MOSFETs M_(A) and M_(B) are on, there islittle voltage difference across the terminals SD₁ and SD₂.

FIGS. 9 and 10 schematically illustrate in more detail, one embodimentof switch driver circuitry of the type described herein. FIG. 9 shows aschematic diagram of circuitry for interfacing to a control signal, aswell as the NMOS gate driver circuitry for the CMOS switch. FIG. 10shows schematically the PMOS gate driver circuitry for the CMOS switch.

Referring to FIG. 9, N-channel MOSFET differential pair M₁ and M₂provides an interface between a control voltage V_(CONTROL) and the gatedriver circuitry via terminal V_(CONTROL). Control voltage V_(CONTROL)is preferably a logic signal that is set to one of two levels, a highlevel greater than threshold voltage V_(THR) or a low level less thanthreshold voltage V_(THR). When control voltage V_(CONTROL) is set tothe high level, N-channel MOSFET M₁ is turned on and conductssubstantially all of the current from current source I₁, and N-channelMOSFET M₂ is substantially OFF. When control voltage V_(CONTROL) is setto the low level, N-channel MOSFET M₂ conducts substantially all of thecurrent from current source I₁, and N-channel MOSFET M₁ is substantiallyin an OFF-state. In this manner, control voltage V_(CONTROL) steers thecurrent from current source I₁ to flow through one of eitherdiode-connected P-channel MOSFET M₃ or M₄.

Source-drain voltage terminal V_(SD1) is preferably connected to one ofthe two signal terminals of the CMOS switch to be controlled by the gatedriver circuitry, and source-drain voltage terminal V_(SD2) ispreferably connected to the other of the two signal terminals of theCMOS switch to be controlled. For example referring to FIG. 3, terminalV_(SD1) would preferably be connected to terminal SD₂ of the CMOS switchand V_(SD2) would preferably be connected to terminal SD₂ of the CMOSswitch. Terminal V_(CONN) is preferably connected to the gate terminalof the N-channel MOSFET in the CMOS switch to be controlled.

Referring again to FIG. 9, P-channel MOSFET M₁₁, along withdiode-connected P-channel MOSFET M₉, diode-connected N-channel MOSFETM₁₀, and current source I₂ in FIG. 9 form a source-follower buffer forsource-drain voltage V_(SD1), such that the voltage V_(ONN) at thesource of MOSFET M₉ is substantially given by:V _(ONN) =V _(SD1) +V _(SG11) +V _(GS10) +V _(SG9),

where V_(SG11), V_(GS10), and V_(SG9) are the gate-source (orsource-gate) voltages of M₁₁, M₁₀, and M₉, respectively, and all arepositive quantities.

The gate-source voltages are substantially constant with changes insource-drain voltage V_(SD1) to the extent that current source I₂ isconstant, since the gate of N-channel MOSFET M₁₂ provides negligibleloading on the source of MOSFET M₉. MOSFET M₁₁ is preferably of theminimum geometry allowed by the process design rules and voltagerequirements in order to minimize the capacitive loading on the voltageV_(SD1). In an example of one embodiment, the value of current source I₂is approximately 10 μA, and the nominal value of the sum of gate-sourcevoltages of MOSFETs M₉ though M₁₁ is 9V. Thus the voltage V_(ONN) at thesource of MOSFET M₉ will substantially equal the preferred ON-voltagefor the N-channel MOSFET in the CMOS switch to be controlled, asdescribed above.

N-channel MOSFET M₁₂ and current source I₃ act as a source-followerbuffer for voltage V_(ONN) such that the voltage at the source of MOSFETM₁₂ is substantially equal to V_(ONN)-V_(GS12), where V_(GS12) is thegate-source voltage of MOSFET M₁₂. The preferred value for currentsource I₃ is equal to the value of current source I₁. When controlvoltage V_(CONTROL) is high, the current from current source I₁ issteered via MOSFETs M₁ to M₃. Further, since there is substantially nocurrent flowing in MOSFET M₄, there is also substantially no currentflowing in P-channel MOSFET M₅, N-channel MOSFET M₆, or N-channel MOSFETM₇. The gate and source terminals of MOSFET M₃ are connected to the gateand source terminals, respectively, of P-channel MOSFET M₈, forming acurrent minor. MOSFET M₈ preferably has a gate width equal to one halfof the gate-width of MOSFET M₃, resulting in a current equal to one halfof the value of current source I₁ being sourced from the drain of M₈.The current flows through diode-connected P-channel MOSFET M₁₄, sinceN-channel MOSFET M₇ is turned OFF. The fact that MOSFET M₇ is turned OFFalso ensures that diode-connected P-channel MOSFET M₁₇ conductssubstantially no current. Under these conditions, MOSFETs M₁₂ and M₁₄will each be operating with a source-drain current equal to one half thevalue of current source I₁. Since MOSFETs M₁₂ and M₁₄ are, under theseconditions, operating at substantially the same current, theirgate-source voltages will be substantially the same. Therefore, thevoltage at terminal V_(CONN) will be substantially equal to the voltageat the source of MOSFET M₉ or V_(ONN) which, as described above, is thepreferred ON voltage for the N-channel MOSFET portion of a single CMOSswitch in a programmable-gain amplifier.

N-channel MOSFET M₁₃, along with current source I₄, forms a secondsource-follower buffer for voltage V_(SD1). N-channel MOSFET M₁₆, alongwith current source I₅, forms a source-follower buffer for CMOS switchsignal voltage V_(SD2). MOSFETs M₁₃ and M₁₆ are preferably of theminimum geometry allowed by the process design rules and voltagerequirements in order to minimize the capacitive loading on the voltageV_(SD1) and V_(SD2), respectively. Current sources I₄ and I₅ arepreferably substantially the same value, each equal to 10 μA in oneillustrative embodiment. The voltages at the sources of MOSFETs M₁₃ andM₁₆ will be substantially V_(S13)=V_(SD1)-V_(GS13) andV_(S16)=V_(SD2)-V_(GS16), respectively, where V_(GS13) and V_(GS16) arethe gate-source voltages of MOSFETs M₁₃ and M₁₆, respectively. SinceMOSFETs M₁₃ and M₁₆ operate at the same current, their gate-sourcevoltages will be substantially equal.

P-channel MOSFETs M₁₅ and M₁₈, along with current source I₆ form a“less-than or equal-to” circuit. M₁₅ and M₁₈ are preferablyidentical-geometry devices. If the voltage V_(S13) is substantially lessthan the voltage V_(S16), then substantially all of the current fromcurrent source I₆ will be conducted by MOSFET M₁₅, and the voltageV_(S15) at the junction of the sources of MOSFETs M₁₅ and M₁₈ will be:V_(S15)=V_(SD1)-V_(GS13)+V_(SG15), where V_(SG15) is the source-gatevoltage of M₁₅. If the voltage V_(S16) is substantially less than thevoltage V_(S13), then substantially all of the current from currentsource I₆ will be conducted by MOSFET M₁₈, and the voltage at thejunction of the sources of MOSFETs M₁₅ and M₁₈ will be:V_(S15)=V_(SD2)-V_(GS16)+V_(SG18), where V_(SG18) is the source-gatevoltage of MOSFET M₁₈. Noting that the gate-source voltages of N-channeland P-channel MOSFETs are of opposite polarities, the voltage V_(S15)will be the lesser of V_(SD1) or V_(SD2), plus an offset voltage equalto the difference between the magnitudes of the gate-source voltages ofone N-channel MOSFET and one P-channel MOSFET. While it should be clearthat it is possible to ensure that this offset voltage is approximatelyzero, this can only be done approximately, since the threshold voltagesof N-channel and P-channel devices are subject to independent processvariations. However, this level of accuracy is sufficient in mostinstances, as will be shown below.

When control voltage V_(CONTROL) is low, the current from current sourceI₁ is steered via MOSFETs M₂ to M₄. Further, since there issubstantially no current flowing in MOSFET M₃, there is alsosubstantially no current flowing in MOSFET M₈, and MOSFET M₁₄ is turnedOFF. The gate and source terminals of MOSFET M₄ are connected to thegate and source terminals, respectively, of P-channel MOSFET M₅, forminga current mirror. MOSFET M₅ preferably has a gate width equal to onehalf of the gate-width of MOSFET M₄, resulting in a current equal to onehalf of the value of current source I₁ being sourced from the drain ofMOSFET M₅. The current flows through diode-connected MOSFET M₆ and ismirrored to MOSFET M₇. Thus, a current equal to one half of the value ofcurrent source I₁ is sunk by MOSFET M₇, which flows throughdiode-connected MOSFET M₁₇. In one implementation the value of thecurrent provided by current source I₆ is equal to the value of I₁. Thus,half of the current from source I₆ flows through MOSFET M₁₇, while thebalance is available for either MOSFETs M₁₅ or M₁₈, or both, dependingon the relative levels of the voltage V_(SD1) and V_(SD2) providedrespectively at the terminals S_(D1) and S_(D2). The voltage at terminalV_(CONN) under these conditions will be substantially equal to thelesser of V_(SD1) or V_(SD2) plus the aforementioned offset dependent onthe difference between N-channel and P-channel gate-source voltages,minus the gate-source voltage of M₁₇. The magnitude of the gate-sourcevoltage of M₁₇ is always sufficient to ensure that the voltage atV_(CONN) will be slightly below the lesser of voltages V_(SD1) orV_(SD2), which, as described above, is one implementation of theOFF-voltage for the N-channel MOSFET portion of a single CMOS switch ina programmable-gain amplifier according to the present invention.

FIG. 10 schematically illustrates additional circuitry to create a gatedrive signal for the P-channel MOSFET in the CMOS switch to becontrolled. The terminals labeled V_(MON) and V_(MOFF) are intended tobe connected to the identically named terminals in FIG. 9. Thus, thegate and drain terminals of MOSFETs M₃ and M₄ in FIG. 9 are connected tothe gate terminals of P-channel MOSFETs M₁₉ and M₂₂ in FIG. 10,respectively. The terminals labeled V_(SD1) and V_(SD2) in FIG. 10connect to the identically named terminals in FIG. 9, as well as to thesignal terminals SD₁ and SD₂ of the CMOS switch to be controlled asillustrated in FIG. 3. In one implementation, terminal V_(CONP) isconnected to the gate terminal of the P-channel MOSFET in the CMOSswitch to be controlled.

N-channel MOSFET M₂₃, along with diode-connected P-channel MOSFETM_(24,) diode-connected N-channel MOSFET M₂₅, and current source I₇ inFIG. 10 form a third source-follower buffer for source-drain voltageV_(SD1), such that the voltage V_(ONP) at the source of M₂₅ issubstantially given by: V_(ONP)=V_(SD1)-V_(GS24)-V_(SG24)-V_(GS25),where V_(GS23), V_(SG24), and V_(GS25) are the gate-source (orsource-gate) voltages of M₂₃, M₃₄, and M₂₅, respectively, and all arepositive quantities. These gate-source voltages are substantiallyconstant with changes in source-drain voltage V_(SD1) to the extent thatcurrent source I₇ is constant, since the gate of N-channel MOSFET M₂₇provides negligible loading on the source of MOSFET M₂₅. MOSFET M₂₃ ispreferably of the minimum geometry allowed by the process design rulesand voltage requirements in order to minimize the capacitive loading onthe voltage V_(SD1). In an example of one embodiment, the value ofcurrent provided by current source I₇ is approximately 10 μA, and thenominal value of the sum of gate-source voltages of MOSFETs M₂₃ thoughM₂₅ is 9V. Thus, the voltage V_(ONP) at the source of MOSFET M₂₅ willsubstantially equal the preferred ON-voltage for the N-channel MOSFET inthe CMOS switch to be controlled, as described above.

P-channel MOSFET M₂₇ and current source I₈ act as a source-followerbuffer for voltage V_(ONP) such that the voltage at the source of MOSFETM₂₇ is substantially equal to V_(ONP)+V_(SG27), where voltage V_(SG27)is the source-gate voltage of MOSFET M₂₇. The preferred value forcurrent source I₈ is equal to the value of current provided by currentsource I₁ in FIG. 9. Referring to FIG. 9, when control voltageV_(CONTROL) is high, the current from current source I₁ is steered viaMOSFETs M₁ to M₃, and there will be substantially no current flowing inMOSFET M₄. Since the gates and drains of MOSFET M₄ (FIG. 8) and MOSFETM₂₂ (FIG. 9) are connected together, there will be substantially nocurrent flowing in P-channel MOSFET M₂₂. Similarly, the gate and sourceterminals of MOSFET M₃ (FIG. 8) are connected to the gate and sourceterminals, respectively, of P-channel MOSFET M₁₉ (FIG. 9), forming acurrent mirror. MOSFET M₁₉ preferably has a gate width equal to one halfof the gate-width of MOSFET M₃, resulting in a current equal to one halfof the value of current provided by current source I₁ being sourced fromthe drain of MOSFET M₁₉. Referring to FIG. 10, the current flows throughdiode-connected N-channel MOSFET M₂₀, which forms a current minor withN-channel MOSFET M₂₁. Therefore the drain current of MOSFET M₂₁ will besubstantially equal to one half of the drain current of current sourceI₁ in FIG. 9. The drain current will flow through diode-connectedP-channel MOSFET M₂₈, since (as noted above) MOSFET M₂₂ is turned OFF.The fact that MOSFET M₂₂ is turned OFF also ensures that diode-connectedN-channel MOSFET M₃₂ conducts substantially no current. Under theseconditions, MOSFET M₂₇ and M₂₈ will each be operating with asource-drain current equal to one half the value of current provided bycurrent source I₁. Since MOSFETs M₂₇ and M₂₈ are, under theseconditions, operating at substantially the same current level, theirgate-source voltages will be substantially the same. Therefore, thevoltage at terminal V_(CONP) will be substantially equal to the voltageat the source of MOSFET M₂₅ (or V_(ONP)) which, as described above, isthe preferred ON-voltage for the P-channel MOSFET portion of a singleCMOS switch in a programmable-gain amplifier.

P-channel MOSFET M₂₆, along with current source I₉, forms a fourthsource-follower buffer for voltage V_(SD1). N-channel MOSFET M₃₀, alongwith current source I₁₀, forms a second source-follower buffer for CMOSswitch signal voltage V_(SD2). MOSFETs M₂₆ and M₃₀ are preferably of theminimum geometry allowed by the process design rules and voltagerequirements in order to minimize the capacitive loading on the voltagesV_(SD1) and V_(SD2), respectively. Current sources I₉ and I₁₀ arepreferably substantially the same value, each equal to 10 μA in oneexample of an embodiment. The voltages at the sources of MOSFETs M₂₆ andM₃₀ will be substantially V_(S26)=V_(SD1)+V_(SG26) andV_(S30)=V_(SD2)-V_(SG30), respectively, where voltages V_(SG26) andV_(SG30) are the source-gate voltages of MOSFETs M₂₆ and M₃₀,respectively. Since MOSFETs M₂₆ and M₃₀ operate at the same currentlevel, their source-gate voltages will be substantially equal. N-channelMOSFETs M₂₉ and M₃₁, along with current source I₁₁, form a “greater-thanor equal-to” circuit. MOSFET M₂₉ and M₃₁ are preferablyidentical-geometry devices. If the voltage V_(S26) is substantiallygreater than the voltage V_(S30), then substantially all of the currentfrom I₁₁ will be conducted by M₂₉, and the voltage V_(S29) at thejunction of the sources of MOSFETs M₂₉ and M₃₁ will be:V_(S29)=V_(SD1)+V_(SG26)-V_(GS29). If the voltage V_(S30) issubstantially greater than the voltage V_(S26), then substantially allof the current from current source I₁₁ will be conducted by MOSFET M₃₁,and the voltage at the junction of the sources of MOSFETs M₂₉ and M₃₁will be: V_(S29)=V_(SD2)+V_(SG30)-V_(GS31). Noting that the gate-sourcevoltages of N-channel and P-channel MOSFETs are of opposite polarities,the voltage V_(S29) will be the greater of either voltage V_(SD1) orV_(SD2), plus an offset voltage equal to the difference between themagnitudes of the gate-source voltages of one N-channel MOSFET and oneP-channel MOSFET.

Referring to FIG. 9, when control voltage V_(CONTROL) is low, thecurrent from current source I₁ is steered via MOSFET M₂ to M₄. Further,since there is substantially no current flowing in MOSFET M₃, there isalso substantially no current flowing in MOSFET M₁₉ in FIG. 10.Therefore MOSFETs M₂₀, M₂₁, and M₂₈ in FIG. 10 are also turned OFF. Thegate and source terminals of MOSFET M₄ are connected to the gate andsource terminals, respectively, of P-channel MOSFET M₂₂ in FIG. 10,forming a current minor. MOSFET M₂₂ preferably has a gate width equal toone half of the gate-width of MOSFET M₄, resulting in a current equal toone half of the value of current source I₁ being sourced from the drainof MOSFET M₂₂, which flows through diode-connected MOSFET M₃₂. The valueof current source I₁₁ is preferably equal to the value of the currentprovided by current source I₁. Thus, half of the current from currentsource I₁₁ flows through MOSFET M₃₂, while the balance is available foreither MOSFETs M₂₉ or M₃₁, or both, depending on the relative levels ofthe voltages V_(SD1) and V_(SD2). The voltage at terminal V_(CONP) underthese conditions will be substantially equal to the greater of the twovoltages V_(SD1) and V_(SD2), plus the aforementioned offset dependenton the difference between N-channel and P-channel gate-source voltages,plus the gate-source voltage of MOSFET M₃₂. The magnitude of thegate-source voltage of MOSFET M₃₂ is always sufficient to ensure thatthe voltage V_(CONP) will be slightly above the greater of the voltagesV_(SD1) and V_(SD2), which, as described above, is the preferred OFFvoltage for the P-channel MOSFET portion of a single CMOS switch in aprogrammable-gain amplifier according to the present invention.

An additional advantage of this architecture is the ability to controlthe turn-on and turn-off times of the CMOS switches in theprogrammable-gain amplifier. In audio applications in particular, fastvoltage transitions on the gates of the MOSFETs making up the switchescan be capacitively coupled to the channels via the gate-to-channelcapacitance, resulting in audible “clicks” during gain transitions. Thisphenomenon, sometimes referred to as “charge injection,” can beminimized by choosing geometries for the N-channel and P-channel devicesthat make up the switch that result in matched gate-channel capacitancesbetween the N-channel and P-channel devices. (In this approach, the gateof each device is driven from an opposite-moving signal, so that the twosignals inject equal and opposite charge into the signal path, whichtheoretically cancel each other out.) However, this approach is almostnever completely successful in eliminating audible clicks when the gatesare driven with very fast rise times. Thus, providing a voltage rampwith a predetermined rate of change between the ON-voltage andOFF-voltage to the gates of the MOSFETs in the switch is a desirablecharacteristic for the gate drive circuitry of a programmable gainamplifier for audio applications.

Referring to FIG. 9, when a fast low-to-high transition in the voltageV_(CONTROL) is applied to the V_(CONTROL) terminal, (a) the current fromcurrent source I₁ is steered from MOSFETs M₄ to M₃, (b) MOSFET M₁₇ isturned OFF, and (c) MOSFET M₈ is turned ON. This current steering occursvery quickly as all of the relevant nodes are relatively low-impedance.However, when MOSFET M₈ turns ON, its drain current will not immediatelyflow through MOSFET M₁₄, but must first charge any load capacitanceconnected to the V_(CONN) terminal. Preferably, the primary loadcapacitance on this node is the gate-to-channel capacitance of theN-channel device in the CMOS switch. This can be quite significant, asthe geometries required for the low-on resistance switches needed in alow-noise programmable-gain amplifier are very large compared with thegeometries of the devices in the gate drive circuitry. By scaling thevalue of current source I₁, and with it the values of current sources I₃and I₆ in proportion, the rate of change between the OFF and ON-statesof the N-channel device in the switch can be controlled.

Similarly, when a fast high-to-low transition in V_(CONTROL) is applied,MOSFET M₈ turns OFF and MOSFET M₇ turns on very quickly. The currentsunk by MOSFET M₇ charges the load capacitance (not shown) on theV_(CONN) terminal, providing a controlled ramp between the ON andOFF-states of the switch. It should be clear to those skilled in the artthat the drive circuitry for the P-channel MOSFET in the switch, shownin FIG. 10, will behave in a similar fashion as that for the N-channelMOSFET.

In a preferred embodiment, the geometries of the CMOS switches arescaled in size to suit the requirements for noise and distortionperformance required of the analog gain amplifier at its variousprogrammable gains. Typically, gain-control switches S₁ through S_(N)shown in FIG. 2 would be scaled such that the switches that activate thehighest gain setting would have the lowest ON-resistance, and thus bethe widest switches. For instance, in FIG. 2, gain control switch S_(N)would be the widest and switch S₁ would be the narrowest. Gain-controlswitches SF₁ through SF_(M) would preferably be scaled such that theON-resistance of each would be chosen to have negligible compared to itsassociated series resistor R_(F1) through R_(FM). Once these geometriesare chosen, the values of I₁, I₃, I₆, I₈, and I₁₁ of the correspondingcurrent sources may be chosen for each of the individual gate drivecircuits to provide the same ramp rate for gate voltage transitions forall switches. Larger switches, which have larger capacitance, would havelarger values for currents I₁, I₃, I₆, I₈ and I₁₁, while smallerswitches, which have smaller capacitances, would have smaller values forcurrents I₁, I₃, I₆, I₈, and I₁₁. In one example, these currents rangedfrom 1 μA to 16 μA to achieve an approximately 20 μsec transition timebetween ON and OFF-states for all switches.

Alternatively to scaling the value of I₁ and other currentsproportionately for each geometry of switch, the values of current I₁and its proportionate other currents could be constant for all drivecircuits, and the ratio of the widths of MOSFET M₃ to M₈, as well asMOSFETs M₁₉, M₂₀, and M₂₁, and M₄ to M₅, M₆, M₇, and M₂₂, could bescaled inversely to the width of the devices in the associated switch toachieve similar results. Further, scaling the ratio of the width ofMOSFETs M₇ to M₈ and MOSFETs M₂₁ to M₂₂ can be done if different ratesof change of gate drive voltage for ON-to-OFF and OFF-to-ON transitionsare desired.

It should be clear that the general approach described herein can beapplied to other programmable-gain amplifier and/or switchingtopologies. In particular, the switch driver described may be applied tothe programmable-gain instrumentation amplifier shown in FIG. 4 of theCopending Application. It may also be employed for otherprogrammable-gain amplifier topologies, and for simple switchingtopologies, where low distortion, low noise, and high-voltage capabilityare desired. Further, changes in the types of semiconductor devicesemployed may be made.

It should be noted that although the MOSFETs M_(A) and M_(B) of theswitch shown in FIG. 3 is described as having a source and drain, itshould be appreciated that in the context that these devices are beingused (as switches with time varying signals applied), which terminal ofeach MOSFET is the source and which is the drain switches as the signalchanges polarity. In one embodiment the MOSFETs are physicallysymmetrical devices, and the bias conditions distinguish and thereforedetermine which terminal is functioning as the source and which isfunctioning as the drain. For N-channel devices, the terminal that is atthe lower potential (with respect to the gate) is the source and theterminal with the higher potential is the drain. The opposite is truefor the P-channel device. So the gate drive circuit maintains the proper“gate-source voltage” with respect to the correct terminal. In theimplementation of FIG. 8, the gate drive circuit maintains the proper“gate-source voltage” as a function of the outputs of the“less-than-or-equal-to” Block₁ and the “greater-than-or-equal-to” Block₂of the SDC. Accordingly, it should be understood that each MOSFET isdescribed as including two source-drain terminals because each terminalis capable of operating as either depending on how the MOSFET is biased.

Thus, a new and improved dynamic switch driver for a low-distortionprogrammable-gain amplifier such as the type described in the CopendingApplication is provided in accordance with the present disclosure. Theexemplary embodiments described in this specification have beenpresented by way of illustration rather than limitation, and variousmodifications, combinations and substitutions may be effected by thoseskilled in the art without departure either in spirit or scope from thisdisclosure in its broader aspects and as set forth in the appendedclaims.

The new and improved dynamic switch driver for a low-distortionprogrammable-gain amplifier of the type described in the CopendingApplication and method of the present disclosure as disclosed herein,and all elements thereof, are contained within the scope of at least oneof the following claims. No elements of the presently disclosed systemand method are meant to be disclaimed, nor are they intended tonecessarily restrict the interpretation of the claims. In these claims,reference to an element in the singular is not intended to mean “one andonly one” unless specifically so stated, but rather “one or more.” Allstructural and functional equivalents to the elements of the variousembodiments described throughout this disclosure that are known or latercome to be known to those of ordinary skill in the art are expresslyincorporated herein by reference, and are intended to be encompassed bythe claims. Moreover, nothing disclosed herein is intended to bededicated to the public, regardless of whether such disclosure isexplicitly recited in the claims. No claim element is to be construedunder the provisions of 35 U.S.C. §112, sixth paragraph, unless theelement is expressly recited using the phrase “means for” or, in thecase of a method claim, the element is recited using the phrase “stepfor.”

1. A switching circuit for switching a time-varying input signal, theswitching circuit comprising: at least one switch including a N-channelMOSFET and a P-channel MOSFET, each having a gate configured to receivea drive signal to change the ON/OFF state of the switch; and a drivecircuit configured and arranged so as to selectively apply a pair ofdrive signals to change the ON/OFF state of the switch, the drivecircuit being configured and arranged to generate the drive signals as afunction of (a) a pair DC signal components sufficient to change theON/OFF state of the switch and (b) a pair of time-varying signalcomponents as at least a partial replica of the signal present on thesource terminal of each MOSFET so that when applied with the DC signalsto the gates of the n-channel MOSFET and p-channel MOSFET respectively,the drive signals will be at the appropriate level to maintain theON/OFF state of the switch and keep the gate-source voltages of eachMOSFET within the gate-source breakdown limit of the MOSFETs; whereinthe n-channel MOSFET and p-channel MOSFET each include two source-drainterminals, and the drive circuit is configured and arranged so that whenthe switch is in the OFF-state, the voltage applied to the gate of then-channel MOSFET is equal to or more negative than the voltage appliedto the most negative source-drain of the n-channel MOSFET, and thevoltage applied to the gate of the p-channel MOSFET is more positivethan the voltage applied to the most positive source-drain of thep-channel MOSFET.
 2. A switching circuit according to claim 1, whereinthe MOSFETs are configured so that one source-drain of one MOSFET iscoupled to one source-drain of the other MOSFET to form a first coupledpair of MOSFET source-drain terminals, and the remaining source-drainterminals of the MOSFETs are coupled to each other to form a secondcoupled pair of MOSFET source-drain terminals.
 3. A switching circuitfor switching a time-varying input signal, the switching circuitcomprising: at least one switch including a N-channel MOSFET and aP-channel MOSFET, each having a gate configured to receive a drivesignal to change the ON/OFF state of the switch; and a drive circuitconfigured and arranged so as to selectively apply a pair of drivesignals to change the ON/OFF state of the switch, the drive circuitbeing configured and arranged to generate the drive signals as afunction of (a) a pair DC signal components sufficient to change theON/OFF state of the switch and (b) a pair of time-varying signalcomponents as at least a partial replica of the signal present on thesource terminal of each MOSFET so that when applied with the DC signalsto the gates of the n-channel MOSFET and p-channel MOSFET respectively,the drive signals will be at the appropriate level to maintain theON/OFF state of the switch and keep the gate-source voltages of eachMOSFET within the gate-source breakdown limit of the MOSFETs; whereinthe n-channel MOSFET and p-channel MOSFET each include two source-drainterminals, and the drive circuit is configured and arranged so that whenthe switch is in the ON-state, the voltage applied to the gate of then-channel MOSFET is sufficiently positive with respect to that of itssource-drain terminals so that the n-channel MOSFET provides a desiredon resistance, and the gate-source voltage applied to the gate of thep-channel MOSFET is sufficiently negative with respect to that of itssource-drain terminals so that the p-channel MOSFET provides a desiredon-resistance so that the two MOSFETs conduct.
 4. A switching circuitaccording to claim 3, wherein the gate-source voltage applied to thegate of the n-channel MOSFET is more positive than the voltage at thesource and drain of the n-channel MOSFET when the switch is in theON-state, and the gate-source voltage applied to the gate of thep-channel MOSFET is more negative than the voltage at the source anddrain of the p-channel MOSFET when the switch is in the ON-state.
 5. Aswitching circuit for switching a time-varying input signal, theswitching circuit comprising: at least one switch including a N-channelMOSFET and a P-channel MOSFET, each having a gate configured to receivea drive signal to change the ON/OFF state of the switch; and a drivecircuit configured and arranged so as to selectively apply a pair ofdrive signals to change the ON/OFF state of the switch, the drivecircuit being configured and arranged to generate the drive signals as afunction of (a) a pair DC signal components sufficient to change theON/OFF state of the switch and (b) a pair of time-varying signalcomponents as at least a partial replica of the signal present on thesource terminal of each MOSFET so that when applied with the DC signalsto the gates of the n-channel MOSFET and p-channel MOSFET respectively,the drive signals will be at the appropriate level to maintain theON/OFF state of the switch and keep the gate-source voltages of eachMOSFET within the gate-source breakdown limit of the MOSFETs; furthercomprising first and second electronically-controlled selectors, eachselector having first and second input terminals and one output terminaland one control terminal, wherein the control terminal is configured toreceive a control signal that determines whether the first inputterminal or the second input terminal is electrically coupled to theoutput terminal, and wherein the control terminals on the two selectorsare coupled to one another.
 6. A switching circuit according to claim 5,further including (a) a first buffer amplifier, (b) a first offsetvoltage generator having a negative terminal coupled to the output ofthe first buffer amplifier, the first offset voltage generator includinga positive terminal coupled to the first input terminal of the firstelectronically controlled selector, and (c) a second offset voltagegenerator having a positive terminal coupled to the output terminal ofthe first buffer amplifier, and a negative terminal coupled to the firstinput terminal of the second electronically controlled selector.
 7. Aswitching circuit according to claim 6, further including aless-than-or-equal-to circuit including a first input terminal forreceiving a first input signal, and second input terminal for receivinga second input signal, and an output terminal for producing an outputsignal proportional to the more negative of the two input signals.
 8. Aswitching circuit according to claim 7, further including agreater-than-or-equal-to circuit including a first input terminal forreceiving a first input signal, and second input terminal for receivinga second input signal, an output terminal for producing an output signalproportional to the more positive of the two input signals.
 9. Aswitching circuit according to claim 8, wherein the output terminal ofthe first buffer amplifier is coupled to the first input terminal of theless-than-or-equal-to circuit and to the first input terminal of thegreater-than-or equal-to circuit, the output terminal of the secondbuffer amplifier is coupled to the second input terminal of theless-than-or-equal-to circuit and to the second input terminal of thegreater-than-or equal-to circuit, the output terminal of theless-than-or-equal-to circuit is coupled to the second input terminal ofthe first electronically controlled selector, and the output terminal ofthe greater-than-or-equal-to circuit is coupled to the second inputterminal of the second electronically controlled selector, wherein whenthe control signal applied to the two selectors is in one state, theoffset voltage produced by the first offset voltage generator added tothe output signal from the first buffer amplifier is coupled to the gateof the N-channel MOSFET of the switch and the offset voltage produced bythe second offset voltage generator subtracted from the output signalfrom the first buffer amplifier is coupled to the gate of the P-channelMOSFET of the switch and when the control signal applied to the twoselectors is in the a second state, the more negative of the outputs ofthe two buffer amplifiers is coupled to the gate of the N-channel MOSFETand the more positive of the outputs from the two buffer amplifiers iscoupled to the P-channel MOSFET of the switch.